mixers - double-balanced - chip 4 4 - 28 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com gaas mmic double-balanced mixer, 5 - 20 ghz v05.1007 general description features functional diagram input ip3: +25 dbm lo / rf isolation: 30 db if bandwidth: dc to 3 ghz small size: 2.10 x 1.45 x 0.1 mm electrical speci cations, t a = +25 c, lo drive = +20 dbm typical applications the hmc143 & hmc144 is ideal for: ? microwave point-to-point radios ? vsat the hmc143 chip is a minature double-balanced mixer which can be used as an upconverter or down- converter. the chip utilizes a standard 1m gaas mesfet process. the hmc144 is identical to the hmc143 except that the layout is a mirror image designed to ease integration into image-reject mixer modules. broadband operation and excellent isolations are provided by on-chip baluns, which require no external components and no dc bias. the design is similar to the hmc141/142 mixers but with an if combiner in a double-balanced design, providing improved rf/if isolation. these devices are much smaller and more reliable replacements to hybrid diode mixers. hmc143 / hmc144 parameter min. typ. max. min. typ. max. min. typ. max. units frequency range, rf & lo 5 - 10.5 10.5 - 15.5 15.5 - 20 ghz frequency range, if dc - 3 dc - 3 dc - 3 ghz conversion loss 10 12 10 12 10 12 db noise figure (ssb) 10 12 10 12 10 12 db lo to rf isolation 26 30 24 28 26 30 db lo to if isolation 15 18 12 15 14 17 db ip3 (input) 21 25 23 dbm ip2 (input) 50 50 50 dbm 1 db gain compression (input) 10 15 10 15 10 15 dbm
mixers - double-balanced - chip 4 4 - 29 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com conversion gain vs. temperature @ lo = +20 dbm isolation @ lo = +20 dbm -20 -15 -10 -5 0 4 6 8 10121416182022 +25 c +85 c -55 c conversion gain (db) frequency (ghz) upconverter performance conversion gain @ lo = +20 dbm conversion gain vs. lo drive return loss @ lo = +20 dbm if bandwidth @ lo = +20 dbm -50 -40 -30 -20 -10 0 4 6 8 10121416182022 rf to if lo to rf lo to if isolation (db) frequency (ghz) -20 -15 -10 -5 0 4 6 8 10121416182022 lo = +13 dbm lo = +15 dbm lo = +17 dbm lo = +20 dbm conversion gain (db) frequency (ghz) -25 -20 -15 -10 -5 0 4 6 8 10121416182022 rf lo return loss (db) frequency (ghz) -30 -25 -20 -15 -10 -5 0 0123456 if conversion gain if return loss response (db) frequency (ghz) -20 -15 -10 -5 0 4 6 8 10121416182022 conversion gain (db) frequency (ghz) hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz
mixers - double-balanced - chip 4 4 - 30 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com input ip3 vs. temperature @ lo = +20 dbm input ip3 vs. lo drive* input ip2 vs. lo drive* input p1db vs. temperature @ lo = +20 dbm * two-tone input power = 0 dbm each tone, 1 mhz spacing. 0 5 10 15 20 25 30 35 4 6 8 10121416182022 lo = +13 dbm lo = +15 dbm lo = +17 dbm lo = +20 dbm ip3 (dbm) frequency (ghz) 0 5 10 15 20 25 30 35 4 6 8 10121416182022 +25 c +85 c -55 c ip3 (dbm) frequency (ghz) 0 10 20 30 40 50 60 70 80 4 6 8 10121416182022 lo = +13 dbm lo = +15 dbm lo = +17 dbm lo = +20 dbm ip3 (dbm) frequency (ghz) 0 5 10 15 20 25 4 6 8 10121416182022 +25c +85c -55c p1db (dbm) frequency (ghz) hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz
mixers - double-balanced - chip 4 4 - 31 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com absolute maximum ratings rf / if input +15 dbm lo drive +27 dbm if dc current 2 ma channel temperature 150 c continuous pdiss (t=85 c) (derate 14.2 mw/c above 85 c) 924 mw thermal resistance (r th ) (junction to package bottom) 70.4 c/w storage temperature -65 to +150 c operating temperature -55 to +85 c esd sensitivity (hbm) class 1a die packaging information [1] standard alternate wp-4 [2] [1] refer to the packaging information section for die packaging dimensions. [2] for alternate packaging information contact hittite microwave corporation. harmonics of lo mxn spurious @ if port nlo mrf01234 0xx-1118 2 22 1430461531 26761636968 37774806880 47277778080 rf = 6 ghz @ -10 dbm lo = 6.1 ghz @ 20 dbm all values in dbc relative to the if power level. measured as downconverter. nlo spur @ rf port lo freq. (ghz) 1 2 3 4 637355838 838365446 10 33 36 50 56 12 28 28 41 n/a 14 30 40 n/a n/a 16 33 41 n/a n/a 18 32 47 n/a n/a 20 29 43 n/a n/a lo = +20 dbm all values in dbc below input lo level @ rf port. hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz electrostatic sensitive device observe handling precautions
mixers - double-balanced - chip 4 4 - 32 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com outline drawings (see hmc143/144 operation application note) hmc143 hmc144 notes: 1. all dimensions are in inches [mm]. 2. die thickness is .004. 3. typical bond pad is .004 square. 4. backside metallization: gold. 5. bond pad metallization: gold. 6. backside metal is ground. 7. connection not required for unlabeled bond pads. hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz
mixers - double-balanced - chip 4 4 - 33 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com pad number function description interface schematic 1 (2) lo this pin is ac coupled and matched to 50 ohms. 2 (1) rf this pin is ac coupled and matched to 50 ohms. 3 (3) if this pin is dc coupled. for applications not requiring operation to dc, this port should be dc blocked externally using a series capacitor whose value has been chosen to pass the necessary if frequency range. for operation to dc, this pin must not source/ sink more than 2 ma of current or die non-function and possible die failure will result. gnd the backside of the die must be connected to rf ground. pad descriptions hmc143 (hmc144) hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz
mixers - double-balanced - chip 4 4 - 34 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com assembly drawing hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz
mixers - double-balanced - chip 4 4 - 35 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle or gel based esd protective containers, and then sealed in an esd protective bag for shipment. once the sealed esd protective bag has been opened, all die should be stored in a dry nitrogen environment. cleanliness: handle the chips in a clean environment. do not attempt to clean the chip using liquid cleaning systems. static sensitivity: follow esd precautions to protect against esd strikes. transients: suppress instrument and bias supply transients while bias is applied. use shielded signal and bias cables to minimize inductive pick-up. general handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. the surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or ngers. mounting the chip is back-metallized and can be die mounted with ausn eutectic preforms or with electrically conductive epoxy. the mount ing surface should be clean and at. eutectic die attach: a 80/20 gold tin preform is recommended with a work surface temperature of 255 c and a tool temperature of 265 c. when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 c. do not expose the chip to a temperature greater than 320 c for more than 20 seconds. no more than 3 seconds of scrubbing should be required for attachment. epoxy die attach: apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding rf bonds made with 0.003 x 0.0005 ribbon are recommended. these bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. all bonds should be made with a nominal stage temperature of 150 c. a minimum amount of ultrasonic energy should be applied to achieve reliable bonds. all bonds should be as short as possib le, less than 12 mils (0.31 mm). hmc143 / hmc144 v05.1007 gaas mmic double-balanced mixer, 5 - 20 ghz
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